 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| ZMD-Standard November 2003 Package PQFP64 (10x10) Dimensions in millimetres Based on JEDEC JEP95: MO-143 1 Dimensions MDS 755 Supersedes Edition 12.98 Z Detail Z A2 0,1 A LP A1 bp 0,1 M 64 1 D HD Dimensions of Sub-Group B1 enom Amax bPmin bPmax HEmin HEmax HDmin HDmax LPmin 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0.50 2.45 0.15 0.30 12.95 13.45 12.95 13.45 0.73 0,6 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends e HE E Dimensions of Sub-Group C1 A1min A1max A2min A2max cmin cmax Dmin Dmax Emin Emax min max 0.10 0.50 1.95 2.10 0.13 0.23 9.90 10.10 9.90 10.10 0 10 Zentrum Mikroelektronik Dresden Editor: signed Schoder Check: signes Marx Date: 03. November 2003 Quality: signed Lorenz Doc-No. QS-000755-HD-02 c |
Price & Availability of MDS755
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |